Customization: | Available |
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CAS No.: | 9009-54-5 |
Formula: | C3h8n2o |
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Electronic Potting Glue | ||||
HDPOL-8057 / HDISO-871 | ||||
Description: The main agent A glue (HDPOL-8057) is a polyol mixture, which reacts with the curing agent B glue (HDISO-871) (modified isocyanate) to form a polyurethane elastomer. It has excellent processing fluidity. This material is specifically designed for electronic potting applications. The potting compound prepared by the reaction of glue A (HDPOL-8057) and glue B (HDISO-871) has excellent electrical properties, weather resistance and flame retardancy. Widely used in communications, electrical, electronics, instrumentation components sealing and machine manufacturing industries. | ||||
Performance Parameters | ||||
Physical Parameters | ||||
Item | HDPOL-8057 | HDISO-871 | ||
appearance | light yellow transparent liquid | light yellow transparent liquid | ||
Proportion(25ºC) | 0.9±0.05 | 1.10 | ||
Viscosity(25ºC) | 400±100 cps | 500+100 | ||
Water Content | ≤0.05% | NA | ||
Flash Point(ºC) | NIL | >220ºC | ||
Typical Formulation and Reaction Rate | ||||
Ratio of A/B | 100/100 | |||
Temperature (ºC) |
10-20 min. (100g/mass) | |||
Curing Conditions | at room temperature: 25-40 minutes at 60°C: 10-15 minutes |
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Characteristic after cured | ||||
Appearance | light yellow transparent liquid | |||
Hardness(Shore A) | 30±5 | |||
Volume Resistance 20ºC | 6.7x1011 ohm-cm | |||
Surface Resistance | 1.0x1013 ohm | |||
Dielectric constant 50MHz, 20ºC | 6.52 | |||
Dielectric loss factor 50MHz | 0.039 | |||
Withstand Voltage 20ºC | 28.0 KV/mm | |||
Tensile Strength | 1.53MPa | |||
Compressive Strength | 15kg/mm2 | |||
Elongation at break | 167% | |||
Thermal Conductivity | 0.264 W/m.K | |||
Flame Retardant | V-0 | |||
Water Absorption | 0.13% | |||
Heat Distortion Temperature | 180ºC | |||
Safety Precautions: Refer to the Safety Data Sheet (MSDS) provided with this product data sheet. |